Alliance with GIO

Mar. 27, 2024

Today, we are thrilled to announce another milestone that GloriousLink (GLi) does. As the distributor also strategic partner to GIO Optoelectronics, we enlarge our business category and service spectrum in the world.

GIO Optoelectronics (abbrev. As GIO below) was established in April 2004, headquartered in Taiwan, with main business of flexible substrate lamination processing business, COB product solid crystal foundry business (monitors, communication antennas, transparent /Flexible LED display), LCD glass substrate processing and LED lighting and power supply, as well as transparency display made by mini LED.

GIO cooperated with Japanese film material manufacturers to develop laminating technology to combine soft and flexible products. The flexible film is attached to the glass carrier, giving the film sufficient rigidity and flatness, and is compatible with all TFT and semiconductor processes. After the flexible substrate completes the necessary processes and removes the film, it becomes a soft and flexible application, such as electronic paper, flexible displays (OLED/LED, etc.), flexible sensors and other related products. In terms of future Flexible applications, GIO can provide flexible substrates of various sizes. The production line is compatible with G2.5 (370mmx470mm) to G6 (1500mmx1850mm), and even semiconductor wafer or special-shaped products can be supported. It will occupy a leading position in the supply of flexible substrates in the future. important role.

GIO COB die-bonding foundry services include Pick&Place die-bonding and independent process improvement and development, introducing the mass transfer die-bonding process. The advantage of mass transfer is that it can obtain better die-bonding flatness and consistency, so it is suitable for high-resolution applications. Compared with Pick & Place, the die-bonding method of the ultra-flexible and hard-screen display can shorten the die-bonding time and is suitable for micro LED applications, achieving the benefits of thinning and cost saving. Comparing COB (flip chip) die-bonding with traditional package SMD, the former has advantages in placement accuracy. COB die-bonding has the ability to offset up to +/-15 um. With medium and long-term chip development, it can be relatively It saves chip packaging costs and has the advantage of material costs.

As a professional processor of LCD glass substrates, GIO works closely with customers to continuously improve processes to improve quality and efficiency, reduce production costs, provide customers with more competitive products and services, deepen long-term partnerships with customers, and achieve mutual success. Create a win-win situation for profit.

In the field of LED lighting, GIO has been continuously improving in related optoelectronic design and applications and continues to create value for customers with technology and services. Because it is based on technology and integrated into the design and development process, the quality and reliability of the products and the customer service of the sales are the company’s irreplaceable core values.

Learn more about GIO: https://gio.com.tw/